A Review on Synthesis and Characterization of Some Copper-Oxide Properties and Potential Application
677–718 (2025)
PACS numbers: 61.05.cp, 68.55.J-, 73.61.Le, 78.30.Hv, 78.55.Hx, 78.67.Bf, 81.07.Bc
Received 24 December, 2023; in revised form, 27 December, 2023
Цей огляд зосереджений на синтезі та характеризації тонких напівпровідникових плівок на основі металооксиду p-типу (CuO p-типу), що використовуються для хемічної сенсибілізації. Тонкі плівки CuO p-типу мають ряд переваг над металооксидом n-типу, включаючи вищий каталітичний ефект, низьку залежність від вологости та поліпшену швидкість відновлення. Однак сенсорна продуктивність тонкої плівки CuO тісно пов'язана з власними фізико-хемічними властивостями матеріялу та його товщиною. Остання сильно залежить від методів синтези. Тут розглянуто багато методів, що використовуються для вирощування тонкої плівки CuO p-типу. Оксид Купруму називають багатофункціональним матеріялом завдяки широкому спектру хемічних і фізичних властивостей, які часто дуже чутливі до змін параметрів оброблення, хоча завдяки широким дослідженням і розробкам оптимізація параметрів оброблення все ще перебуває в повному розвитку дотепер. Загальні дослідження показали, що різні властивості оксиду Купруму залежать від експериментальних умов. У цьому розширеному огляді ми більше зосереджуємося на обговоренні впливу основних параметрів синтези, таких як розчин-провісник, температура відпалу та товщина наноматеріялу, які вже одержали різні дослідники. Ці чинники критично розглянуто, оцінено та порівняно.
КЛЮЧОВІ СЛОВА: напівпровідниковий оксид Купруму, методи синтези, тонкі плівки p-CuO, розчин-провісник, температура відпалу
ЛІТЕРАТУРА
- A. J. Resende, Copper-Based p-Type Semiconducting Oxides (from Materials to Devices) (Université Grenoble Alpes–Univ of Liège: 2017) (in French).
- B. K. Meyer, A. Polity, D. Reppin, M. Becker, P. Hering, P. J. Klar, Th. Sander, C. Reindl, J. Benz, M. Eickhoff, C. Heiliger, M. Heinemann, J. Bläsing, A. Krost, S. Shokovets, C. Müller, and C. Ronning, physica status solidi (b), 249, Iss. 8: 487 (2012); https://doi.org/10.1002/pssb.201248128
- T. Mahalingam, J. Chitra, J. Chu, S. Velumani, and P. Sebastian, Solar Energy Materials and Solar Cells, 88, Iss. 2: 209 (2005); https://doi.org/10.1016/j.solmat.2004.05.026
- P. R. Markworth, X. Liu, J. Y. Dai, W. Fan, T. J. Marks, R. P. H. Chang, Journal of Materials Research, 16, Iss. 8: 2408 (2001).
- P. Mitra, Journal of Physical Sciences, 14: 235 (2010).
- A. Y. Oral, E. Menşur, M. H. Aslan, and Engin Başaran, Materials Chemistry and Physics, 83, Iss. 1: 140 (2004); https://doi.org/10.1016/j.matchemphys.2003.09.015
- A. Ogwu, T. Darma, and E. Bouquerel, Journal of Achievements in Materials and Manufacturing Engineering, 24, Iss. 1: 172 (2007).
- M. Al-Kuhaili, Vacuum, 82, Iss. 6: 623, (2008); https://doi.org/10.1016/j.vacuum.2007.10.004
- K. Santra, C. Sarkar, M. Mukherjee, and B. Ghosh, Thin Solid Films, 213, Iss. 2: 226 (1992); https://doi.org/10.1016/0040-6090(92)90286-K
- N. Silva, S. Ramírez, I. Díaz, A. Garcia, and N. Hassan, Materials, 12, Iss. 5: 804 (2019); https://doi.org/10.3390/ma12050804
- S. Mosleh, M.R. Rahimi, M. Ghaedi, K. Dashtian, and S. Hajati, Ultrasonics Sonochemistry, 40: 601 (2018); https://doi.org/10.1016/j.ultsonch.2017.08.007
- E. Mousali and M. A. Zanjanchi, Journal of Solid State Electrochemistry, 23, Iss. 3: 925 (2019); https://doi.org/10.1007/s10008-019-04194-9
- H. Abbasian, D. Ghanbari, and G. Nabiyouni, Journal of Nanostructures, 3, Iss. 4: 429 (2013); https://doi.10.7508/JNS.2013.04.007
- V.V. Khedekar and B. M. Bhanage, Journal of the Electrochemical Society, 163, Iss. 6: B248 (2016); https://doi.10.1149/2.1101606jes
- S. Bhuvaneshwari and N. Gopalakrishnan, Journal of Colloid and Interface Science, 480: 76 (2016); https://doi.org/10.1016/j.jcis.2016.07.004
- M. S. Araújo, R. R. Silva, G. Pacheco, W. R. Lustri, A. Tercjak, J. Gutierrez, J. R. S. Júnior, F. H. C. Azevedo, G. S. Figuêredo, M. L. Vega, S. J. L. Ribeiro, and H. S. Barud, Carbohydrate Polymers, 179: 341 (2018); https://doi.org/10.1016/j.carbpol.2017.09.081
- Z. Zhong, V. Ng, J. Luo, S.-P. Teh, J. Teo, and A. Gedanken, Langmuir, 23, Iss. 11: 5971 (2007).
- J. Zhang, J. Wang, Y. Fu, B. Zhang, and Z. Xie, RSC Advances, 5, Iss. 36: 28786 (2015); https://doi.10.1039/C5CP02150B
- M. A. Choudhary, R. Manan, M. Aslam Mirza, H. Rashid Khan, S. Qayyum, and Z. Ahmed, Int. J. Mater. Sci. Eng., 4, Iss. 1: 1 (2018).
- E. Souza, R. Landers, L. Cardoso, T. G. Cruz, M. Tabacniks, and A. Gorenstein, Journal of Power Sources, 155, Iss. 2: 358 (2006); https://doi.org/10.1016/j.jpowsour.2005.04.014
- J. Kampmann, S. Betzler, H. Hajiyani, S. Häringer, M. Beetz, T. Harzer, J. Kraus, B. V. Lotsch, C. Scheu, R. Pentcheva, D. Fattakhova-Rohlfing, and T. Bein, Nanoscale, 12, Iss. 14: 7766 (2020); https://doi.10.1039/D0NJ05788F
- R. Wu, Z. Ma, Z. Gu, and Y. Yang, 2010 International Conference on Mechanic Automation and Control Engineering (2010), p. 3183; https://doi.10.1109/MACE.2010.5535652
- N. Al Armouzi, G. El Hallani, A. Liba, M. Zekraoui, H. S. Hilal, N. Kouider, and M. Mabrouki, Materials Research Express, 6, Iss. 11: 116405 (2019); https://doi.10.1088/2053-1591/ab44f3
- C. Mrabet, R. Jaballah, N. Mahdhi, A. Boukhachem, and M. Amlouk, Journal of Alloys and Compounds, 968: 172252 (2023); https://doi.org/10.1016/j.jallcom.2023.172252
- A. A. Radhakrishnan and B. B. Beena, Indian J. Adv. Chem. Sci., 2, Iss. 2: 158 (2014).
- H. Zhu, D. Han, Z. Meng, D. Wu, and C. Zhang, Nanoscale Research Letters, 6: 1 (2011); https://doi.org/10.1186/1556-276X-6-181
- J. V. Bruckner, S. S. Anand, and D. A. Warren, Casarette and Doull's Toxicology: The Basic Science of Poison (Ed. C. D. Klaassen) (2008), p. 981–1051.
- R. Aelion, A. Loebel, and F. Eirich, The Hydrolysis and Polycondensation of Tetra Alkoxysilanes, Recueil des Travaux Chimiques des Pays-Bas, 69, Iss. 1: 61 (1950); https://doi.org/10.1002/recl.19500690109
- T. H. Tran and V. T. Nguyen, International Scholarly Research Notices, 2014: Article ID 856592 (2014); http://dx.doi.org/10.1155/2014/856592
- M. Z.-C. Hu, E. A. Payzant, and C. H. Byers, Journal of Colloid and Interface Science, 222, Iss. 1: 20 (2000); https://doi.org/10.1006/jcis.1999.6610
- U. T. Khatoon, K. Mohan Mantravadi, and G. Nageswara Rao, Materials Science and Technology, 34, Iss. 18: 2214 (2018); https://doi.org/10.1080/02670836.2018.1482600
- A. Kahru and H. C. Dubourguier, Toxicology, 269, Iss. 2–3: 105 (2010); https://doi.org/10.1016/j.tox.2009.08.016
- P. C. Y. Ng, B. J. Long, W. T. Davis, D. J. Sessions, and A. Koyfman, Internal and Emergency Medicine, 13: 375 (2018); https://doi.org/10.1007/-018-1799-9
- T. Munekata, T. Suzuki, S. Yamakawa, and R. Asahi, Physical Review E, 88, Iss. 5: 052314 (2013); https://doi.org/10.1103/PhysRevE.88.052314
- D. B. Potter, I. P. Parkin, and C. J. Carmalt, RSC Advances, 8, Iss. 58: 33164 (2018); https://doi.10.1039/C8RA06417B
- X.-D. Yang, L.-L. Jiang, C.-J. Mao, H.-L. Niu, J.-M. Song, and S.-Y. Zhang, Materials Letters, 115: 121 (2014); https://doi.org/10.1016/j.matlet.2013.10.037
- L. Guo, F. Tong, H. Liu, H. Yang, and J. Li, Materials Letters, 71: 32 (2012); https://doi.org/10.1016/j.matlet.2011.11.105
- J. Zhu, H. Bi, Y. Wang, X. Wang, X. Yang, and L. Lu, Materials Letters, 61, Iss. 30: 5236 (2007); https://doi.org/10.1016/j.matlet.2007.04.037
- J. Zhu, H. Bi, Y. Wang, X. Wang, X. Yang, and L. Lu, Materials Letters, 61, Iss. 30: 5236 (2007); https://doi.org/10.1016/j.matlet.2007.04.037
- Z. Cheng, J. Xu, H. Zhong, X. Chu, and J. Song, Materials Letters, 65, Iss. 13: 2047 (2011); https://doi.org/10.1016/j.matlet.2011.04.021
- A. Rydosz, Coatings, 8, Iss. 12: 425 (2018); https://doi.org/10.3390/coatings8120425
- H. Siddiqui, M. R. Parra, and F. Z. Haque, Journal of Sol–Gel Science and Technology, 87: 125 (2018); https://doi.org/10.1007/s10971-018-4663-5
- J. Wang, Y. Qi, Z. Zhi, J. Guo, M. Li, and Y. Zhang, Smart Materials and Structures, 16, Iss. 6: 2673 (2007); https://doi.org/10.1088/0964-1726/16/6/072
- Handbook of Microemulsion Science and Technology (Eds. P. Kumar and K. L. Mittal) (New York, D.C.: US Govt. Printing Office–Marcel Dekker–CRC Press: 1999); https://doi.org/10.1201/9780203752739
- P. Mallick and S. Sahu, Nanoscience and Nanotechnology, 2, Iss. 3: 71 (2012); https://doi.org/10.5923/j.nn.20120203.05
- A. Sawaby, M. S. Selim, S. Y. Marzouk, M. A. Mostafa, and A. Hosny, Physica B: Condensed Matter, 405, Iss. 16: 3412 (2010); https://doi.org/10.1016/j.physb.2010.05.015
- N. Zayyoun, B. Jaber, L. Laânab, E. Ntsoenzok, and R. Bekkari, J. Mater. Environ. Sci., 7, Iss. 5: 1791 (2016).
- H. Serrar, A. Bouabellou, Y. Bouachiba, A. Taabouche, A. Bouhank, Y. Bellal, and H. Merabti, Am. J. Mater. Synth. Process, 3, Iss. 2: 12 (2018); https://doi.10.11648/j.ajmsp.20180302.12
- H. Serrar, A. Bouabellou, Y. Bouachiba, A. Taabouche, A. Bouhank, Y. Bellal, and H. Merabti, Thin Solid Films, 686: 137282 (2019); https://doi.org/10.1016/j.tsf.2019.05.001
- Zaid Hamid Mahmoud, Nuha Farhan Abdul Kareem, and Aklas Ahmed Abdul Kareem, Asian J. Chem., 30: Iss. 1: 223 (2018); https://doi.org/10.14233/ajchem.2018.21047
- E. Benrezgua, B. Deghfel, Z. Abdelhalim, W. J. Basirun, R. Amari, A. Boukhari, M. K. Yaakob, S. Kheawhom, and A. A. Mohamad, Journal of Molecular Structure, 1267: 133639 (2022); https://doi.org/10.1016/j.molstruc.2022.133639
- L. Znaidi, Materials Science and Engineering: B, 174, Iss. 1–3: 18 (2010); https://doi.org/10.1016/j.mseb.2010.07.001
- D. Halin, I. Talib, A. Daud, and M. Hamid, International Journal of Photoenergy, 2014: Article ID 352156 (2014); https://doi.org/10.1155/2014/352156
- P. Samarasekara and N. Premasiri, arXiv preprint arXiv: 1806.03976 (2018); https://doi.org/10.48550/arXiv.1806.03976
- T. Jiang, Y. Wang, D. Meng, X. Wu, J. Wang, and J. Chen, Applied Surface Science, 311: 602 (2014); https://doi.org/10.1016/j.apsusc.2014.05.116
- Indian Institute of Metals, Vol. 21 (1968).
- O. Reyes, D. Maldonado, J. Escorcia-García, and P. Sebastian, Journal of Materials Science: Materials in Electronics, 29: 15535 (2018); https://doi.org/10.1007/s10854-018-9110-4
- S. Farhad, S. Majumder, M. A. Hossain, N. Tanvir, R. Akter, and M. A. Patwary, MRS Advances, 4, Iss. 16: 937 (2019); https://doi.org/10.1557/adv.2019.139
- V. Avrutin, N. Izyumskaya, and H. Morkoç, Superlattices and Microstructures, 49, Iss. 4: 337 (2011); https://doi.org/10.1016/j.spmi.2010.12.011
- A. Rakhshani, A. Al-Jassar, and J. Varghese, Thin Solid Films, 148, Iss. 2: 191 (1987); https://doi.org/10.1016/0040-6090(87)90157-X
- L. Olsen, F. Addis, and W. Miller, Solar Cells, 73: 247 (1982); https://doi.org/10.1016/0379-6787(82)90050-3
- G. Sığırcık and T. Tüken, Journal of Materials Science: Materials in Electronics, 31: 17855 (2020); https://doi.org/10.1007/s10854-020-04339-x
- Z. N. Kayani, W. Chaudhry, R. Sagheer, S. Riaz, and S. Naseem, Materials Science and Engineering: B, 283: 115799 (2022); https://doi.org/10.1016/j.mseb.2022.115799
- A. Maini and M. Shah, International Journal of Ceramic Engineering & Science, 3, Iss. 4: 192 (2021); https://doi.org/10.1002/ces2.10097
- K. Iimura, Y. Ishikawa, T. Kikuchi, T. Takai, H. Satone, and M. Suzuki, Journal of the Ceramic Society of Japan, 125, Iss. 8: 634 (2017); https://doi.org/10.2109/jcersj2.17012
- T. Fujiwara, T. Nakaue, and M. Yoshimura, Solid State Ionics, 175, Iss. 1–4: 541 (2004); https://doi.org/10.1016/j.ssi.2004.01.081
- Q. Zhu, Y. Zhang, J. Wang, F. Zhou, and P. K. Chu, Journal of Materials Science & Technology, 27, Iss. 4: 289 (2011); https://doi.org/10.1016/S1005-0302(11)60064-9
- T. Karthik, A. Hernández, Y. Kudriavtsev, H. Gómez-Pozos, M. Ramírez-Cruz, L. Martínez-Ayala, and A. Escobosa-Echvarria, Journal of Materials Science: Materials in Electronics, 31: 7470 (2020); https://doi.org/10.1007/s10854-020-02987-7
- S. Benramache and B. Benhaoua, Open Physics, 14, Iss. 1: 714 (2016); https://doi.org/10.1515/phys-2016-0080
- S. Joishy, S. D. Kulkarni, R. Choudary, S. R. Maidur, P. S. Patil, and B. Rajendra, Materials Research Express, 6, Iss. 10: 106447 (2019); https://doi.10.1088/2053-1591/ab4153
- S. Kaur and M. Deshwal, Transactions on Electrical and Electronic Materials, 20, Iss. 4: 309 (2019); https://doi.org/10.1007/s42341-019-00113-x
- M. Dhaouadi, M. Jlassi, I. Sta, I. B. Miled, G. Mousdis, M. Kompitsas, and W. Dimassi, Am. J. Phys. Appl., 6, Iss. 2: 43 (2018); https://doi.10.11648/j.ajpa.20180602.13
- S. Alghamdi, A. O. M. Alzahrani, and M. Aida, Journal of Optics, 52, Iss. 2: 803 (2023); https://doi.org/10.1007/s12596-022-01001-z
- C. Abdelmounaïm, Z. Amara, A. Maha, and D. Mustapha, Materials Science in Semiconductor Processing, 43: 214 (2016); https://doi.org/10.1016/j.mssp.2015.12.019
- C. Ravi Dhas, Dinu Alexander, A. Jennifer Christy, K. Jeyadheepan, A. Moses Ezhil Raj, and C. Sanjeevi Raja, Asian Journal of Applied Sciences, 7, Iss. 8: 67 (2014); https://doi.org/10.3923/ajaps.2014.671.684
- A. S. Kumar, K. Perumal, and P. Thirunavukkarasu, Optoelec. Advan. Mater. — Rapid Commun., 4, Iss. 6: 831 (2010).
- V. Jagadeesan and V. Subramaniam, Journal of Materials Science: Materials in Electronics, 30: 1571 (2019); https://doi.org/10.1007/s10854-018-0428-8
- D. Gopalakrishna, K. Vijayalakshmi, and C. Ravidhas, Ceramics International, 39, Iss.7: 7685, (2013); https://doi.org/10.1016/j.ceramint.2013.03.021
- R. Shabu, A. M. E. Raj, C. Sanjeeviraja, and C. Ravidhas, Materials Research Bulletin, 68: 1 (2015); https://doi.org/10.1016/j.materresbull.2015.03.016
- H. Hashim, S. S. Shariffudin, M. S. P. Sarah, and N. I. Nasir, 2016 IEEE International Conference on Semiconductor Electronics (ICSE) (17–19 August 2016) (IEEE: 2016), p. 224; https://doi.org/10.1109/SMELEC.2016.7573632
- M. Yurddaskal, T. Dikici, and E. Celik, Ceramics International, 42, Iss. 15: 17749 (2016); https://doi.org/10.1016/j.ceramint.2016.08.102
- A. Hassanien, A. Atta, M. El-Nahass, S. I. Ahmed, A. A. Shaltout, A. M. Al-Baradi, A. Alodhayb, and A. Kamal, Optical and Quantum Electronics, 52: 1 (2020); https://doi.org/10.1007/s11082-020-02306-8
- C. Vidyasagar, Y. Arthoba Naik, T. Venkatesha, and R. Viswanatha, Nano-Micro Letters, 4: 73 (2012); https://doi.org/10.1007/BF03353695
- K. Khojier and A. Behju, International Journal of Nano Dimension, 2, Iss. 3: 185 (2012).
- M. Heinemann, B. Eifert, and C. Heiliger, Physical Review B, 87, Iss. 11: 115111 (2013); https://doi.org/10.1103/PhysRevB.87.115111
- A. S. Zoolfakar, R. A. Rani, A. J. Morfa, A. P. O'Mullane, and K. Kalantar-Zadeh, Journal of Materials Chemistry C, 2, Iss. 27: 5247 (2014); https://doi.org/10.1039/C4TC00345D
- G. Fritz-Popovski, F. Sosada-Ludwikowska, A. Köck, J. Keckes, and G. A. Maier, Sci. Rep., 9, Iss. 1: 807 (2019); https://doi.org/10.1038/s41598-018-37172-8
- L. Yuan, Y. Wang, R. Mema, and G. Zhou, Acta Materialia, 59, Iss. 6: 2491 (2011); https://doi.org/10.1016/j.actamat.2010.12.052
- I. A. Ezenwa, Research Journal of Chemical Sciences, 2: Iss. 3: 26 (2012); https://www.isca.me/rjcs/Archives/v2/i3/5.ISCA-RJCS-2011-252%20Done.php
- P. Ooi, S. Ng, M. Abdullah, H. A. Hassan, and Z. Hassan, Materials Chemistry and Physics, 140, Iss. 1: 243 (2013); https://doi.org/10.1016/j.matchemphys.2013.03.028
- R. D. Prabu, S. Valanarasu, V. Ganesh, M. Shkir, S. AlFaify, A. Kathalingam, S. Srikumar, and R. Chandramohan, Materials Science in Semiconductor Processing, 74: 129 (2018); https://doi.org/10.1016/j.mssp.2017.10.023
- D. Ozaslan, O. Erken, M. Gunes, and C. Gumus, Physica B: Condensed Matter, 580: 411922 (2020); https://doi.org/10.1016/j.physb.2019.411922
- Y. H. Ribeiro, J. D. S. Pereira, D. G. David, and M. V. da Silva, Thin Solid Films, 757: 139381 (2022); https://doi.org/10.1016/j.tsf.2022.139381
- K. Khojier, H. Savaloni, and Z. Sadeghi, Journal of Theoretical and Applied Physics, 8: 1 (2014); https://doi.org/10.1007/s40094-014-0116-x
- F. A. Akgul, G. Akgul, N. Yildirim, H. E. Unalan, and R. Turan, Materials Chemistry and Physics, 147, Iss. 3: 987 (2014); https://doi.org/10.1016/j.matchemphys.2014.06.047
- M. Mabrouki, Materials Today: Proceedings, 13: 771 (2019); https://doi.org/10.1016/j.matpr.2019.04.039
- A. A. Baqer, K. A. Matori, N. M. Al-Hada, H. M. Kamari, A. H. Shaari, E. Saion, and J. L. Y. Chyi, Journal of Materials Science: Materials in Electronics, 29: 1025 (2018); https://doi.org/10.1007/s10854-017-8002-3
- A. H. Mashhad-Toroghi, N. Shahtahmasebia, E. Azhira, P. Madahia, and M. Mashreghi, Proceedings of the 4th International Conference on Nanostructures (ICNS4) (IR Iran: Kish Island: 2012), p. 12–14.
- G. Tunell, Ε. Posnjak, and C. Ksanda, Zeitschrift für Kristallographie — Crystalline Materials, 90, Iss. 1–6: 120 (1935); https://doi.org/10.1524/zkri.1935.90.1.120
- S. Åsbrink and L.-J. Norrby, Acta Crystallographica Section B: Structural Crystallography and Crystal Chemistry, 26, Iss. 1: 8 (1970); https://doi.org/10.1107/S0567740870001838
- D. Volanti, D. Keyson, L. Cavalcante, A. Z. Simões, M. Joya, E. Longo, J. A. Varela, P. Pizani, and A. Souza, Journal of Alloys and Compounds, 459, Iss. 1–2: 537 (2008); https://doi.org/10.1016/j.jallcom.2007.05.023
- G. Pezzotti, Journal of Applied Physics, 113, Iss. 21: 8 (2013); https://doi.org/10.1063/1.4803740
- B. Balamurugan, B. Mehta, D. Avasthi, F. Singh, A.K. Arora, M. Rajalakshmi, G. Raghavan, A. Tyagi, and S. Shivaprasad, Journal of Applied Physics, 92, Iss. 6: 3304 (2002); https://doi.org/10.1063/1.1499752
- N. Touka, D. Tabli, and K. Badari, Journal of Optoelectronics and Advanced Materials, 21, Iss. 12: 698 (2019).
- M. L. Zeggar, M. Aida, and N. Attaf, Journal of New Technology and Materials, 277, Iss. 1747: 1 (2014).
- S. B. Sadale, S. B. Patil, A. M. Teli, H. Masegi, and K. Noda, Solid State Sciences, 123: 106780 (2022); https://doi.org/10.1016/j.solidstatesciences.2021.106780
- D. S. Che Halin, I. A. Talib, A. R. Daud, and M. A. A. Hamid, Materials Science Forum, 819: 189 (2015); https://doi.org/10.4028/www.scientific.net/MSF.819.189
- Y. Liu, J. Zhang, W. Zhang, W. Liang, B. Yu, and J. Xue, Journal of Wuhan University of Technology—Mater. Sci. Ed., 30, Iss. 1: 92 (2015); https://doi.org/10.1007/s11595-015-1106-9
- U. Akgul, K. Yildiz, and Y. Atici, The European Physical Journal Plus, 131: 1 (2016); https://doi.org/10.1140/epjp/i2016-16089-3
- L. Huang, S. Yang, T. Li, B. Gu, Y. Du, Y. Lu, and S. Shi, Journal of Crystal Growth, 260, Iss. 1–2: 130 (2004); https://doi.org/10.1016/j.jcrysgro.2003.08.012
- A. Ravichandran, K. Dhanabalan, R. Chandramohan, A. Vasuhi, and P. Parameswaran, International Journal of Information Research and Review, 1: 007 (2014).
- F. Mugwang'a, P. Karimi, W. Njoroge, O. Omayio, and S. Waita, International Journal of Thin Films Science and Technology, 2, Iss. 1: 15 (2013).
- L. D. L. S. Valladares, D. H. Salinas, A. B. Dominguez, D. A. Najarro, S. Khondaker, T. Mitrelias, C. Barnes, J. A. Aguiar, and Y. Majima, Thin Solid Films, 520, Iss. 20: 6368 (2012); https://doi.org/10.1016/j.tsf.2012.06.043
- W. Zheng, Y. Chen, X. Peng, K. Zhong, Y. Lin, and Z. Huang, Materials, 11, Iss. 7: 1253 (2018); https://doi.org/10.3390/ma11071253
- X. Zhang, Z. Li, and J. Fan, Materials Science in Semiconductor Processing, 137: 106227 (2022); https://doi.org/10.1016/j.mssp.2021.106227
- T. Çayir Taşdemirci, Electronic Materials Letters, 16: 239 (2020); https://doi.org/10.1007/s13391-020-00205-4
- M. R. Johan, M. S. M. Suan, N. L. Hawari, and H. A. Ching, Int. J. Electrochem. Sci., 6, Iss. 12: 6094 (2011); https://doi.org/10.1016/S1452-3981(23)19665-9
- N. Al Armouzi, M. Manoua, H. S. Hilal, A. Liba, and M. Mabrouki, Processes, 10, Iss. 7: 1277 (2022); https://doi.org/10.3390/pr10071277
- H. B. Saâd, M. Ajili, S. Dabbabi, and N. T. Kamoun, Superlattices and Microstructures, 142: 106508 (2020); https://doi.org/10.1016/j.spmi.2020.106508
- O. Abdelouahab, Rahmane Saâd, Ben Messaoud Ouarda, K. Aicha, and S. Mostefa, Iranian Journal of Materials Science and Engineering, 19, Iss. 1: (2022); https://doi.10.22068/ijmse.2582
- L. Chabane, N. Zebbar, M. L. Zeggar, M. Aida, M. Kechouane, M. Trari, Materials Science in Semiconductor Processing, 40: 840 (2015); https://doi.org/10.1016/j.mssp.2015.07.080
- S. Shariffudin, S. Khalid, N. Sahat, M. Sarah, and H. Hashim, IOP Conference Series: Materials Science and Engineering, 99, Iss. 1: 012007 (2015); https://doi.10.1088/1757-899X/99/1/012007
- V. Bhuse, P. Hankare, K. Garadkar, and A. Khomane, Materials Chemistry and Physics, 80, Iss. 1: 82 (2003); https://doi.org/10.1016/S0254-0584(02)00306-1
- S. A. M. H. M. Ali, Journal of Multidisciplinary Engineering Science Studies, 2: 532 (2016).
- K. Kamli, Z. Hadef, B. Chouial, and B. Hadjoudja, Surface Engineering, 35, Iss. 1: 86 (2019); https://doi.org/10.1080/02670844.2018.1475052
- O. Reyes-Vallejo, J. Escorcia-García, and P. Sebastian, Materials Science in Semiconductor Processing, 138: 106242 (2022); https://doi.org/10.1016/j.mssp.2021.106242
- V. Chawla, N. Sardana, H. Kaur, A. Kumar, R. Chandra, and S. Mishra, Applied Surface Science, 504: 144369 (2020); https://doi.org/10.1016/j.apsusc.2019.144369
- L. V. Devi, S. Sellaiyan, S. Sankar, and K. Sivaji, Materials Research Express, 5, Iss. 2: 024002 (2018); https://doi.10.1088/2053-1591/aaa7a3
- I. Singh, S. Dey, S. Santra, K. Landfester, R. Muñoz-Espí, and A. Chandra, ACS Omega, 3, Iss. 5: 5029 (2018).
- N. Sankar, V. Sankaranarayanan, L. Vaidhyanathan, G. Rangarajan, R. Srinivasan, K. Thomas, U. Varadaraju, and G. S. Rao, Solid State Communications, 67, Iss. 4: 391 (1988); https://doi.org/10.1016/0038-1098(88)91051-4
- Bahaa M. Abu-Zied, Salem M. Bawaked, Samia A. Kosa, and Wilhelm Schwieger, Int. J. Electrochem. Sci., 11, Iss. 3: 2230 (2016); https://doi.org/10.1016/S1452-3981(23)16097-4
- Bahaa M. Abu-Zied, Salem M. Bawaked, Samia A. Kosa, and Wilhelm Schwieger, Int. J. Electrochem. Sci, 11, Iss. 2: 1568 (2016); https://doi.org/10.1016/S1452-3981(23)15942-6
- D. Wang, Y. Wang, T. Jiang, H. Jia, and M. Yu, Journal of Materials Science: Materials in Electronics, 27: 2138 (2016); https://doi.org/10.1007/s10854-015-4003-2
- C. Meneses, J. Duque, L. Vivas, and M. Knobel, Journal of Non-Crystalline Solids, 354, Iss. 42–44: 4830 (2008); https://doi.org/10.1016/j.jnoncrysol.2008.04.025
- S. Baig, P. Kumar, J. Ngai, Y. Li, and S. Ahmed, Chem. Phys. Chem., 21, Iss. 9: 895 (2020); https://doi.org/10.1002/cphc.202000005
- M. Ariëns, L. van de Water, A. I. Dugulan, E. Brück, and E. J. Hensen, Journal of Catalysis, 405: 391 (2022); https://doi.org/10.1016/j.jcat.2021.12.013
- W. Wang, Z. Li, W. Zheng, J. Yang, H. Zhang, and C. Wang, Electrochemistry Communications, 11, Iss. 9: 1811 (2009); https://doi.org/10.1016/j.elecom.2009.07.025
- H. Absike, M. Hajji, H. Labrim, A. Abbassi, and H. Ez-Zahraouy, Superlattices and Microstructures, 127: 128 (2019); https://doi.org/10.1016/j.spmi.2017.12.038
- S. Masudy-Panah, K. Radhakrishnan, H. R. Tan, R. Yi, T. I. Wong, and G. K. Dalapati, Solar Energy Materials and Solar Cells, 140: 266 (2015); https://doi.org/10.1016/j.solmat.2015.04.024
- R. M. Thyab, M. A. Al-Hilo, F. A. Yasseen, H. Alshater, E. G. Blall, and M. A. Abdel-Lateef, NeuroQuantology, 20, Iss. 3: 99 (2022); https://doi.10.14704/nq.2022.20.3.NQ22048
- J. H. Bae, J. H. Lee, S. P. Park, T. S. Jung, H. J. Kim, D. Kim, S.-W. Lee, K.-S. Park, S. Yoon, and I. Kang, ACS Applied Materials & Interfaces, 12, Iss. 34: 38350 (2020).
- A. Yildiz, Ş. Horzum, N. Serin, and T. Serin, Applied Surface Science, 318: 105 (2014); https://doi.org/10.1016/j.apsusc.2014.01.118
- D. Tabli, D. N. Touka, K. Baddari, and N. Selmi, Advances in Materials Science, 22, Iss. 3: 5 (2022); https://doi.org/10.2478/adms-2022-0009
- D. Tabli, N. Touka, K. Baddari, and N. Selmi, Advances in Materials Science, 22, Iss. 3: 5 (2022); https://doi.org/10.2478/adms-2022-0009
- H. Siddiqui, M. Qureshi, and F. Z. Haque, Materials Letters, 275: 128090 (2020); https://doi.org/10.1016/j.matlet.2020.128090
- H. Siddiqui, M. R. Parra, M. Qureshi, M. Malik, and F. Z. Haque, Journal of Materials Science, 53, Iss. 12: 8826 (2018); https://doi.org/10.1007/s10853-018-2179-6
- T. V. Thi, A. K. Rai, J. Gim, and J. Kim, Applied Surface Science, 305: 617 (2014); https://doi.org/10.1016/j.apsusc.2014.03.144
- C.-Y. Chiang, Y. Shin, and S. Ehrman, Journal of The Electrochemical Society, 159, Iss. 2: B227 (2011); https://doi.10.1149/2.081202jes
- F. Z. Chafi, L. Bahmad, N. Hassanain, B. Fares, L. Laanab, and A. Mzerd, arXiv preprint arXiv: 1807.09697 (2018); https://doi.org/10.48550/arXiv.1807.09697
- L. V. Devi, T. Selvalakshmi, S. Sellaiyan, A. Uedono, K. Sivaji, and S. Sankar, Journal of Alloys and Compounds, 709: 496 (2017); https://doi.org/10.1016/j.jallcom.2017.03.148
- S. Bhuvaneshwari and N. Gopalakrishnan, Journal of Alloys and Compounds, 654: 202 (2016); https://doi.org/10.1016/j.jallcom.2015.09.046
- Sayantan Das and T. L. Alford, Journal of Applied Physics, 113: 244905 (2013); https://doi.org/10.1063/1.4812584
- A. Menazea and A. M. Mostafa, Journal of Environmental Chemical Engineering, 8, Iss. 5: 104104 (2020); https://doi.org/10.1016/j.jece.2020.104104
- S. Vidhya, O. Balasundaram, and M. Chandramohan, Journal of Optoelectronics and Advanced Materials, 17: 963 (2015).
- J. Wu, K. Hui, K. Hui, L. Li, H.-H. Chun, and Y. Cho, Journal of Materials Science: Materials in Electronics, 27: 1719 (2016); https://doi.org/10.1007/s10854-015-3945-8
- F. Bayansal, Y. Gülen, B. Şahin, S. Kahraman, and H. Çetinkara, Journal of Alloys and Compounds, 619: 378 (2015); https://doi.org/10.1016/j.jallcom.2014.09.085