Download the full
version of the article (in PDF format)
T.R. SANGEETA and J. DENY
Inter/Intra-Chip Optical Wireless Communication
with Robust Plasmonic Nanoantenna Design
847–871 (2024)
PACS numbers: 71.36.+c, 72.80.Vp, 73.20.Mf, 81.05.ue, 84.40.Az, 84.40.Ba, 85.35.-p
This research aims to improve antenna efficiency in inter/intra-chip optical wireless
communication by utilizing plasmonic materials. The proposed model uses an AgSi ground plane with a
silver-coated silicon cube, which mitigates interband transition, while enhancing plasmonic resonance. A
planar plasmonic substrate with atomic MoS2 on a silver surface acts as a barrier against unwanted molecule
infiltration, preventing interband transition. A novel bi-rhombic hybrid nanostrip waveguide is introduced,
featuring two parallel rhombic layers with a hybrid Ag–silicon ribbon material to mitigate ohmic losses and
enhance propagation. The rhombic configuration reduces ohmic losses and optimally amplifies light intensity.
The antenna performance is simulated and evaluated using ANSYS HFSS 2019 R3 software, revealing superior
performance compared to conventional models, validating its efficacy in inter/intra-chip optical wireless
communication applications
KEY WORDS: plasmonic material, bi-rhombic structure, nanostrip waveguide, MoS2 layer, ANSYS HFSS, inter/intra-chip optical wireless communication
DOI: https://doi.org/10.15407/nnn.22.04.847
REFERENCES
- D. G. Baranov, D. A. Zuev, S. I. Lepeshov, O. V. Kotov, A. E. Krasnok, A. B. Evlyukhin, and B. N. Chichkov, Optica, 4, Iss. 7: 814 (2017); https://doi.org/10.1364/OPTICA.4.000814
- S. Eslami and S. Palomba, Nano Convergence, 8: Article No. 41-1 (2021); https://doi.org/10.1186/s40580-021-00290-7
- E. Corcione, D. Pfezer, M. Hentschel, H. Giessen, and C. Tar?n, Sensors, 22, No. 1: 7 (2021); https://doi.org/10.3390/s22010007
- Sreejyothi Sankararaman, Krishna Balasubramanian, and Revathy Padmanabhan, Conference on Lasers and Electro-Optics (9–14 May 2021, San Jose, California, United States). OSA Technical Digest (Eds. J. Kang, S. Tomasulo, I. Ilev, D. M?ller, N. Litchinitser, S. Polyakov, V. Podolskiy, J. Nunn, C. Dorrer, T. Fortier, Q. Gan, and C. Saraceno) (Optica Publishing Group: 2021), paper JW1A.183; https://doi.org/10.1364/CLEO_AT.2021.JW1A.183
- Mohammad Javad Rabienejhad, Azardokht Mazaheri, and Mahdi Davoudi-Darareh, Chin. Phys. B, 30, No. 4: 048401 (2021); https://doi.org/10.1088/1674-1056/abd38e
- Sergi Abadal, Chong Han, and Josep Miquel Jornet, IEEE Access, 8, No. 12: 278 (2019); https://doi.org/10.1109/ACCESS.2019.2961849
- O. M. Haraz, M. M. M. Ali, and T. A. Denidni, 2021 IEEE 19th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM-2012) (Winnipeg, Canada: IEEE Canada: 2021), p. 1.
- Giovanna Cal?, Gaetano Bellanca, Marina Barbiroli, Franco Fuschini, Giovanni Serafino, Davide Bertozzi, Velio Tralli, and Vincenzo Petruzzelli, Optics Express, 29, No. 20: 31212 (2021); https://doi.org/10.1364/OE.427633
- Demos Serghiou, Mohsen Khalily, Tim W. C. Brown, and Rahim Tafazolli, IEEE Communications Surveys & Tutorials, 24, Iss. 4: 1957 (2022); https://doi.org/10.1109/COMST.2022.3205505
- Nitin Gupta and Anuj Dhawan, OSA Continuum, 4, No. 11: 2970 (2021); https://doi.org/10.1364/OSAC.430824
- Fei Dai, Yawen Chen, Haibo Zhang, and Zhiyi Huang, arXiv:2109.14878; https://doi.org/10.48550/arXiv.2109.14878
- Shuchi Tripathi, Nithin V. Sabu, Abhishek K. Gupta, and Harpreet S. Dhillon, arXiv:2102.10267; https://doi.org/10.48550/arXiv.2102.10267
- Arjun Singh, Michael Andrello, Ngwe Thawdar, and Josep Miquel Jornet, IEEE Journal on Selected Areas in Communications, 38, No. 9: 2104 (2020); https://doi.org/10.1109/JSAC.2020.3000881
- Bin Zhang, Josep M. Jornet, Ian F. Akyildiz, and Zhi P. Wu, IEEE Access, 7: 33214 (2019); https://doi.org/10.1109/ACCESS.2019.2903493
- Evgenia Rusak, Jakob Straubel, Piotr G?adysz, Mirko G?ddel, Andrzej K?dziorski, Michael K?hn, Florian Weigend, Carsten Rockstuhl, and Karolina S?owik, Nature Communications, 10: Article No. 5775-1 (2019); https://doi.org/10.1038/s41467-019-13748-4
- Mona Nafari and Josep Miquel Jornet, IEEE Access, 5: 6389 (2017); https://doi.org/10.1109/ACCESS.2017.2690990
- A. A. C. Alves, M. C. Melo, J. J. Siqueira, F. Zanella, J. R. Mej?a-Salazar, and C. S. Arismar, 2020 2nd 6G Wireless Summit (6G SUMMIT) (8–11 June, 2021, Porto, Portugal), p. 1.
- Inzamam Ahmad, Shakir Ullah, Jalal ud din, Sadiq Ullah, Waseem Ullah, Usman Habib, Salahuddin Khan, and Jaume Anguera, Applied Sciences, 11, No. 19: 8893 (2021); https://doi.org/10.3390/app11198893
- Richard Victor Biswas and Farhadur Arin, Research Square, 12: 1 (2021); https://doi.org/10.21203/rs.3.rs-1079661/v1
- Sasmita Dash, Goutam Soni, Amalendu Patnaik, Christos Liaskos, Andreas Pitsillides, and Ian F. Akyildiz, Plasmonics, 16, No. 5: 1855 (2021); https://doi.org/10.1007/s11468-021-01449-y
- S. Kavitha, K. V. S. S. S. S. Sairam, and Ashish Singh, SN Applied Sciences, 4: Article No. 114-1 (2022); https://doi.org/10.1007/s42452-022-04986-1
- Rajveer S. Yaduvanshi, Rama Krishna Yadav, Saurabh Katiyar, Suresh Kumar, and Harish Parthasarathy, Frequenz, 75, Nos. 1–2: 49 (2021); https://doi.org/10.1515/freq-2020-0086
|