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В. О. Зленко, С. І. Проценко
«Двошарові плівки Cu/наночастинки Ni/підкладка»
607–615 (2011)

PACS numbers: 61.46.Hk, 68.37.Lp, 68.55.J-, 73.50.Lw, 73.61.At, 73.63.Bd, 81.15.Ef

Thin films of Ni on polyimide substrates are fabricated by thermal evaporation in a vacuum. Approbation of technique for fabrication of arrays of the metal nanoparticles uniformly distributed over the polymer substrate by dispersion of thin Ni films during a thermal annealing in a vacuum is performed. Microstructure and thermoresistive properties of thin-film (Cu, Ni) solid solution obtained on the base of dispersed nick-el films are studied.

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