Выпуски

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2010

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том 8 / 

выпуск 3

 



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Є. Л. Жавжаров
«Модифікація тонких металевих плівок Ag, Cu, Ni під дією атомарного водню »
553–566 (2010)

PACS numbers: 68.35.Np, 68.37.Hk, 68.55.-a, 68.60.Bs, 73.30.+y, 73.61.At, 81.15.-z

An influence of the atomic hydrogen on the thin films of Ag, Cu, Ni (of 15–200 nm thickness) deposited by thermal evaporation in vacuum on dielectric substrates is studied. Experiments are carried out at temperatures of 300–310 K, pressure of about 20 Pa, and the atomic hydrogen concentrations of 1017–1019 m?3. Kinetics of surface morphology change, work function and conductivity of thin metallic films are revealed and investi-gated. The mechanism explaining the results obtained is pro-posed. Factors, which influence on character and kinetics of change of electrophysical parameters of thin films, are re-vealed.

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