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R. I. BIHUN, V. H. APOPII, and B. P. KOMAN
The Ballistic Regime of Charge Transfer in Nanoscale Cuprum Films
701–707 (2023)
PACS numbers: 73.23.Ad, 73.40.Jn, 73.61.At, 73.63.Bd, 81.07.Bc, 81.40.Rs, 85.35.Gv
Structure and electrical parameters of nanosize copper metallic films deposited on clean glass substrate and substrate pre-coated with wetting underlayer of antimony film with mass thickness of 0.4 nm are experimentally investigated. The limits of classical (Fuchs–Sondheimer and Namba) and ballistic (Fishman–Calecki) models’ applicability for the charge transport in copper films in size range of positive temperature coefficient of resistance are analysed. The effectiveness of wetting antimony underlayers in stabilizing the structure and accelerating the copper-films’ metallization in the ballistic regime for the charge transport is shown.
Key words: thin metal films, electrical conductivity, charge transport.
Issue DOI: https://doi.org/10.15407/nnn.21.04.701
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