Скачать полную версию статьи (в PDF формате)

Я. А. Косенок, В. Е. Гайшун, О. И. Тюленкова, В. В. Туров, Д. П. Савицкий
«Реологические свойства композиционных суспензий на основе силикатного золя и наноразмерных частиц диоксида кремния для применения в электронике»
269–277 (2014)

PACS numbers: 66.20.Ej, 81.16.Dn, 81.65.Ps, 82.70.Kj, 83.50.Uv, 83.60.Pq, 83.80.Hj

The rheological behaviour of the composite suspensions based on silica sol and silica nanoparticles, which can be used at the II-nd stage of polishing of monocrystalline silicon wafers or other semiconductor materials, is investigated. Physically based formulas are presented to describe the effective viscosity depending on degree of balanced destruction and thixotropic reduction of bonds of structure in the process of flow of composite suspension. The resulting formulas are compared with the experimental data. The data on both the regimes of polishing and surface quality of monocrystalline silicon wafers after polishing using the composite suspension are presented.