Collection of scientific works Nanosystems, nanomaterials, nanotechnologies
Year 2025 Volume 23, Issue 2
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A.T. TURDALIEV1, A.S. YERZHANOV2, and B.B. MAKHMUTOV2

1International Transport and Humanitarian University, Zhetisu 1, Microdistrict 32, KZ-050063 Almaty, Kazakhstan
2Karaganda Industrial University, 30, Republic Ave., KZ-101400 Temirtau, Kazakhstan

Study of Copper Microstructure after ECAP and Rolling

603–610 (2025)

PACS numbers: 06.60.Vz, 61.72.Mm, 62.20.fk, 62.23.St, 68.37.Lp, 81.20.Hy, 83.50.Uv

Received 25 February, 2024; in revised form, 26 February, 2024

In this article, the evolution of copper grade microstructure after equal-channel angular pressing (ECAP) and rolling is investigated. There is a relatively equiaxed ultrafine-grained structure formed after rolling after 10 passes of ECAP transformed into a lamellar structure with smaller grain-boundary spacing. After 10 passes of ECAP, the grain-boundary spacing is 180 nm, and it is reduced to 110 nm after rolling. Microstructure grinding during rolling almost does not occur. There is an increase in the share of large-angle boundary by 20% compared to the states after 10 passes of ECAP.

KEY WORDS: microstructure, severe plastic deformation, pressing, rolling

DOI: https://doi.org/10.15407/nnn.23.02.0603

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